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TE Connectivity 2-2013311-1

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TE Connectivity 2-2013311-1

Brand Name : TE Connectivity

Description : Through Hole Inline Module Sockets RoHS

Packaging Details : Through Hole

Model Number : 2-2013311-1

MOQ : 9000

Delivery Time : 25-42 weeks

Stock : 900000

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Product Overview

This product appears to be a connector or socket, likely for memory modules (e.g., DDR3 SODIMM). It features a mechanical key for proper orientation and a latch mechanism for secure mating. The product is designed for PCB mounting and is constructed from high-temperature thermoplastic with copper alloy contacts and stainless steel lock levers.

Brand TE Connectivity
Material - Housing High Temperature Thermo Plastic UL94V-0
Material - Contact Copper Alloy
Material - Lock Lever Stainless Steel
Material - Peg Copper Alloy
Certifications UL94V-0
Package Type Tape & Reel (for automated assembly)
Part Number Pitch Height Type Contact Finish (Area) Contact Finish (Soldering Area) Peg Finish Coplanarity (Max) PCB Thickness
DDR3 SODIMM Socket 0.6 mm 9.2 mm Reverse Type Gold Flash (0.000254 mm min) over Nickel Gold Flash Plating Tin Plating 0.1 mm (Before Soldering) 3.8 mm
DDR3 SODIMM Socket 0.6 mm 9.2 mm Reverse Type 0.00076 mm Gold over Nickel Gold Flash Plating Tin Plating 0.1 mm (Before Soldering) 3.8 mm
DDR3 SODIMM Socket 0.6 mm 9.2 mm Reverse Type 0.007 mm Gold over Nickel Gold Flash Plating Tin Plating 0.1 mm (Before Soldering) 3.8 mm
Pad Finish Chamfer (Max) Component Area (Front Side) Component Area (Back Side) Mechanical Key Center Line
Gold Plating 0.00076 min. Over Ni Plating 0.002min 0.25 x 45 21.5 mm 25.1 mm 35 mm

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